Refrigerant phase change cooling achieves cooling effect on electronic components

Peltier refrigeration has the characteristics of high reliability, but it also has the disadvantages of high cost and low efficiency. It has limitations in the scope of use. It is only suitable for electronic components with compact components and low cooling requirements. Peltier refrigeration technology releases heat while absorbing heat at both ends of the couple when direct current passes through the galvanic couple, and achieves the cooling effect by generating negative thermal resistance. The cooling method using Peltier refrigeration needs to consider whether the refrigeration device meets the requirements of light weight and volume The characteristics of small size, easy installation and disassembly, and stricter requirements for refrigeration devices, Peltier refrigeration technology can be used for small semiconductor refrigeration devices.

The phase change cooling of the refrigerant is the characteristic of using a phase change of the refrigerant to absorb a large amount of heat under certain circumstances, and achieves the cooling effect on the electronic components. The phase change cooling of the refrigerant we usually call is that the refrigerant evaporates At the same time, it takes away the heat in the environment, including two cases of flow boiling and static liquid boiling. Although the phase change cooling technology of refrigerants should be widely used, there are still some technical difficulties related to electronic components that have not been solved, especially It is a technical problem about flow boiling. Conduct energy dissipation during heat dissipation The so-called energy dissipation is to dissipate the heat radiated by electronic components, transfer it to a specific place using heat transfer elements and then process it, or conduct heat to the environment more efficiently. With the increase in the degree of integration of electronic circuits, high-power electronic components have increased and the volume of electronic components has gradually become smaller. The requirements for heat dissipation devices are getting higher and higher. Not only does the heat dissipation device have a higher heat dissipation effect, but also The constraints on the design of heat sinks are becoming more and more strict, which requires our electronic staff to continuously improve their professional qualities, improve the heat sinks, and achieve the effect of heat dissipation during the heat dissipation process.